3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization - Thilo Pionteck,Jan Moritz Joseph,Alberto García-Ortiz,Lennart Bamberg
-30% with code BOOKS
Shipping in 17-23 days
30-day return policy
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical- ... Full description
You May Also Like
TOP
INCOSE Systems Engineering Handbook
-30% with code BOOKS
In stock at our supplier
TOP
If Anyone Builds It, Everyone Dies: The Case Against Superintelligent AI
Eliezer Yudkowsky, Nate Soares
-30% with code BOOKS
In stock at our supplier
TOP
Open Circuits: The Inner Beauty of Electronic Components
Eric Schlaepfer, Windell Oskay
-30% with code BOOKS
In stock at our supplier
TOP
Get started with MicroPython on Raspberry Pi Pico: The Official Raspberry Pi Pico Guide
-30% with code BOOKS
In stock at our supplier
TOP
We Are Not Machines: The Fight for the Future of Work
-30% with code BOOKS
In stock at our supplier
TOP
Foundations of Flavor: The Noma Guide to Fermentation: Including Step-By-Step Information on Making and Cooking with: Koji, Kombuchas, Shoyus, Misos, Vinegars, Garums, Lacto-Ferments and black Fruits Vegetables
-30% with code BOOKS
In stock at our supplier
TOP
Nucleo Boards Programming with the STM32CubeIDE: Hands-on in more than 50 projects
-30% with code BOOKS
In stock at our supplier
TOP
Data-Driven Science and Engineering: Machine Learning, Dynamical Systems, and Control
Steven L. Brunton, J. Nathan Kutz
-30% with code BOOKS
In stock at our supplier
TOP
Black Holes: The Key to Understanding the Universe
-30% with code BOOKS
In stock at our supplier
TOP
Practical Electronics for Inventors
-30% with code BOOKS
In stock at our supplier
TOP
Flowers For Algernon: A Modern Literary Classic
-30% with code BOOKS
In stock at our supplier
TOP
Human Compatible: Artificial Intelligence and the Problem of Control
-30% with code BOOKS
Out of stock
TOP
How To Read Water: Clues & Patterns from Puddles to the Sea
-30% with code BOOKS
In stock at our supplier
TOP
Make: Electronics: Learning by Discovery: A hands-on primer for the new electronics enthusiast
-30% with code BOOKS
In stock at our supplier
TOP
Mastering the Arduino Uno R4: Programming and Projects for the Minima and WiFi
-30% with code BOOKS
In stock at our supplier
TOP
The Idea Factory: Bell Labs and the Great Age of American Innovation
-30% with code BOOKS
In stock at our supplier
TOP
Fundamentals of Aerodynamics ISE
Christopher Cadou, John D. Anderson
-30% with code BOOKS
In stock at our supplier
TOP
Foundation Design and Construction
-30% with code BOOKS
In stock at our supplier
Description
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow¿s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
More Information
| Author | Thilo Pionteck, Jan Moritz Joseph, Alberto García-Ortiz, Lennart Bamberg |
|---|---|
| Publisher | Springer Nature Switzerland |
| Release year | 2022 |
| Cover type | Hardcover |
| EAN | 9783030982287 |