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Advanced Flip Chip Packaging -

English
2013-03-21
โ‚ฌ263.98 โ‚ฌ329.98

-20% with code BOOKS

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance ... Full description

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Description

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

More Information

Publisher Springer US
Release year 2013
Cover type Hardcover
EAN 9781441957672
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โ‚ฌ263.98 โ‚ฌ329.98