Area Array Package Design - Ken Gilleo
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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Description
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
More Information
| Author | Ken Gilleo |
|---|---|
| Publisher | McGraw-Hill Education LLC (Professional Pod) |
| Release year | 2003 |
| Cover type | Softcover |
| EAN | 9780071737739 |