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In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
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Description
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
More Information
| Publisher | CRC Press |
|---|---|
| Release year | 2024 |
| Cover type | Hardcover |
| EAN | 9781032528236 |