ELECTROMIGRATION IN ULSI INTERCONNECTI.. - Tan Cher Ming
-30% with code BOOKS
Shipping in 17-23 days
30-day return policy
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circui ... Full description
You May Also Like
TOP
INCOSE Systems Engineering Handbook
-30% with code BOOKS
In stock at our supplier
TOP
If Anyone Builds It, Everyone Dies: The Case Against Superintelligent AI
Eliezer Yudkowsky, Nate Soares
-30% with code BOOKS
In stock at our supplier
TOP
The Design of Everyday Things
-30% with code BOOKS
In stock at our supplier
TOP
Open Circuits: The Inner Beauty of Electronic Components
Eric Schlaepfer, Windell Oskay
-30% with code BOOKS
In stock at our supplier
TOP
Get started with MicroPython on Raspberry Pi Pico: The Official Raspberry Pi Pico Guide
-30% with code BOOKS
In stock at our supplier
TOP
We Are Not Machines: The Fight for the Future of Work
-30% with code BOOKS
In stock at our supplier
TOP
Foundations of Flavor: The Noma Guide to Fermentation: Including Step-By-Step Information on Making and Cooking with: Koji, Kombuchas, Shoyus, Misos, Vinegars, Garums, Lacto-Ferments and black Fruits Vegetables
-30% with code BOOKS
In stock at our supplier
TOP
Nucleo Boards Programming with the STM32CubeIDE: Hands-on in more than 50 projects
-30% with code BOOKS
In stock at our supplier
TOP
Data-Driven Science and Engineering: Machine Learning, Dynamical Systems, and Control
Steven L. Brunton, J. Nathan Kutz
-30% with code BOOKS
In stock at our supplier
TOP
Black Holes: The Key to Understanding the Universe
-30% with code BOOKS
In stock at our supplier
TOP
Practical Electronics for Inventors
-30% with code BOOKS
In stock at our supplier
TOP
Flowers For Algernon: A Modern Literary Classic
-30% with code BOOKS
In stock at our supplier
TOP
Human Compatible: Artificial Intelligence and the Problem of Control
-30% with code BOOKS
In stock at our supplier
TOP
How To Read Water: Clues & Patterns from Puddles to the Sea
-30% with code BOOKS
In stock at our supplier
TOP
Make: Electronics: Learning by Discovery: A hands-on primer for the new electronics enthusiast
-30% with code BOOKS
In stock at our supplier
TOP
Mastering the Arduino Uno R4: Programming and Projects for the Minima and WiFi
-30% with code BOOKS
In stock at our supplier
TOP
The Idea Factory: Bell Labs and the Great Age of American Innovation
-30% with code BOOKS
In stock at our supplier
TOP
Fundamentals of Aerodynamics ISE
Christopher Cadou, John D. Anderson
-30% with code BOOKS
In stock at our supplier
TOP
Foundation Design and Construction
-30% with code BOOKS
In stock at our supplier
Description
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.
The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
More Information
| Author | Tan Cher Ming |
|---|---|
| Publisher | World Scientific |
| Release year | 2010 |
| Cover type | Hardcover |
| EAN | 9789814273329 |