Guidebook for Managing Silicon Chip Reliability - Michael Pecht,Riko Radojcic,Gopal Rao
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This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and ... Full description
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Description
This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. * Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damange. * Presents information on evolving IC technologies. TOC:Introduction.- How Devices Fail.- Intrinsic Device Sensitivities.- Electromigration.- Hot Carrier Aging.- Time Dependent Dielectric Breakdown. Mechanical Stress Induced Migration.- Alpha Particle Sensitivity.- Electrostatic Discharge and Electrical Overstress. Latch-Up. Qualification. Screening. Design for Reliability. Summary.
More Information
| Author | Michael Pecht, Riko Radojcic, Gopal Rao |
|---|---|
| Publisher | Taylor & Francis Ltd (Sales) |
| Release year | 1998 |
| Cover type | Hardcover |
| EAN | 9780849396243 |