Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins,Suresh K. Sitaraman
-30% with code BOOKS
Shipping in 17-23 days
30-day return policy
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a ... Full description
You May Also Like
TOP
INCOSE Systems Engineering Handbook
-30% with code BOOKS
In stock at our supplier
TOP
If Anyone Builds It, Everyone Dies: The Case Against Superintelligent AI
Eliezer Yudkowsky, Nate Soares
-30% with code BOOKS
In stock at our supplier
TOP
The Design of Everyday Things
-30% with code BOOKS
In stock at our supplier
TOP
Open Circuits: The Inner Beauty of Electronic Components
Eric Schlaepfer, Windell Oskay
-30% with code BOOKS
In stock at our supplier
TOP
Get started with MicroPython on Raspberry Pi Pico: The Official Raspberry Pi Pico Guide
-30% with code BOOKS
In stock at our supplier
TOP
We Are Not Machines: The Fight for the Future of Work
-30% with code BOOKS
In stock at our supplier
TOP
Foundations of Flavor: The Noma Guide to Fermentation: Including Step-By-Step Information on Making and Cooking with: Koji, Kombuchas, Shoyus, Misos, Vinegars, Garums, Lacto-Ferments and black Fruits Vegetables
-30% with code BOOKS
In stock at our supplier
TOP
Nucleo Boards Programming with the STM32CubeIDE: Hands-on in more than 50 projects
-30% with code BOOKS
In stock at our supplier
TOP
Data-Driven Science and Engineering: Machine Learning, Dynamical Systems, and Control
Steven L. Brunton, J. Nathan Kutz
-30% with code BOOKS
In stock at our supplier
TOP
Black Holes: The Key to Understanding the Universe
-30% with code BOOKS
In stock at our supplier
TOP
Practical Electronics for Inventors
-30% with code BOOKS
In stock at our supplier
TOP
Flowers For Algernon: A Modern Literary Classic
-30% with code BOOKS
In stock at our supplier
TOP
Human Compatible: Artificial Intelligence and the Problem of Control
-30% with code BOOKS
In stock at our supplier
TOP
How To Read Water: Clues & Patterns from Puddles to the Sea
-30% with code BOOKS
In stock at our supplier
TOP
Make: Electronics: Learning by Discovery: A hands-on primer for the new electronics enthusiast
-30% with code BOOKS
In stock at our supplier
TOP
Mastering the Arduino Uno R4: Programming and Projects for the Minima and WiFi
-30% with code BOOKS
In stock at our supplier
TOP
The Idea Factory: Bell Labs and the Great Age of American Innovation
-30% with code BOOKS
In stock at our supplier
TOP
Fundamentals of Aerodynamics ISE
Christopher Cadou, John D. Anderson
-30% with code BOOKS
In stock at our supplier
TOP
Foundation Design and Construction
-30% with code BOOKS
In stock at our supplier
Description
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
More Information
| Author | Andrew E. Perkins, Suresh K. Sitaraman |
|---|---|
| Publisher | Springer US |
| Release year | 2008 |
| Cover type | Hardcover |
| EAN | 9780387793931 |