Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Shuye Zhang,Guoli Sun
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There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
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Description
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
More Information
| Author | Shuye Zhang, Guoli Sun |
|---|---|
| Publisher | Institution of Engineering & Technology |
| Release year | 2025 |
| Cover type | Hardcover |
| EAN | 9781837241408 |