Wireless Interface Technologies for 3D IC and Module Integration - Tadahiro Kuroda,Wai-Yeung Yip
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Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the desig ... Full description
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Description
More Information
| Author | Tadahiro Kuroda, Wai-Yeung Yip |
|---|---|
| Publisher | Cambridge University Press |
| Release year | 2021 |
| Cover type | Hardcover |
| EAN | 9781108841214 |